Electromagnetics

A high-fidelity multi-physics CFD study was conducted to ensure PCB thermal reliability, preventing overheating and localized hotspots through detailed electro-thermal simulations. Detailed ECAD data was imported and cleaned to accurately represent the PCB geometry, and orthotropic thermal conductivity maps were generated for each layer based on trace and via distributions. Resistive heating in traces and vias was modeled using DCIR electrical analysis results, and a coupled electro-thermal workflow between Siwave and Icepak was implemented for iterative convergence to capture temperature-dependent electrical behavior accurately. Full conjugate heat transfer models were built including the PCB, mounted components, and surrounding airflow environment. The methodology enabled precise prediction of temperature distribution, identification and mitigation of thermal hotspots, and provided a robust framework for future PCB thermal reliability analysis.